Channel Title: High Yield Channel Description: Analysis, commentary and current developments in hardware and tech. Everything silicon. <video> Apple M3, M3 Pro & M3 Max — Chip Analysis Description: In-depth analysis of Apple's new 3nm chips: M3, M3 Pro and M3 Max. Silicon deep-dive, die-shot analysis and a closer look at CPU, GPU, NPU and the TSMC N3B process node. Follow me on Twitter/X: https://twitter.com/highyieldYT Support me on Patreon: https://www.patreon.com/user?u=46978634 0:00 Intro 0:47 M3 Silicon Analysis 4:17 M3 Pro Silicon Analysis 6:26 M3 Max Silicon Analysis 8:25 Why is the M3 Pro a downgrade? 10:47 NPU deep-dive 12:16 CPU deep-dive 13:17 GPU deep-dive 14:44 GPU architecture / Apple family 9 GPU 16:22 TSMC N3B Process Node 18:44 Wrap-up </video> <video> TSMC FinFlex: How Chips are made Worse to get Better Description: A deep-dive into FinDepopulation & TSMCs FinFlex technology. How the height of transistors is keeping Moore's Law alive. Become a supporter on Patreon: https://www.patreon.com/notifications Follow me on Twitter/X: https://x.com/home SemiAnalysis article: https://www.semianalysis.com/p/iedm2022p1 Ken Shirrif's blog: http://www.righto.com/2024/01/intel-386-standard-cells.html 0:00 Intro 0:50 NMOS, PMOS & CMOS Transistors 3:34 3D FinFETs & Transistor Height 6:48 Logic Gates & Standard Cells 9:54 Process Node Cell Libraries 13:31 How Fin Depopulation works 14:48 FinFET Process Node Scaling 18:34 TSMC FinFlex & Standard Cell Height 23:22 The future of chip design </video> <video> Why Lunar Lake changes (almost) everything Description: Can x86 beat ARM? Chip & architecture deep-dive of Lunar Lake, Lion Cove, Skymont & Xe2 Battlemage. Follow me on X/Twitter: https://x.com/highyieldYT Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 0:00 Intro 0:52 Lunar Lake SoC / on-package memory 3:16 compute tile / chip analysis 6:08 LNL architecture / Lion Cove P-cores 8:30 Lion Cove IPC / Hyper Threading 11:18 Skymont E-cores 12:03 Skymont IPC / SLC / Memory Side Cache 14:06 Skymont vs Raptor Cove 15:01 Xe 2 GPU / Battlemage / GPU TOPS 16:10 Intel Neural Processing Unit / NPU4 17:31 Lunar Lake & x86 vs arm </video> <video> Gate-All-Around — The Future of Transistors Description: What are GAAFETs and how does their shape change the future of transistors? // To find out more about ASM, go to https://lnk.bio/ASMOfficial Follow me on Twitter: https://twitter.com/highyieldYT Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 Asianometry GAA Video: https://www.youtube.com/watch?v=5RPFfPtgw7g 0:00 Intro 0:54 Field Effect Transit / 2D Planar Transistors 2:15 3D FinFET 3:17 Gate-All-Around FET 4:05 GAAFET Manufacturing 5:52 ASM / Atomic Layer Deposition (ALD) 7:30 GAA Process Nodes 7:58 Samsung SF3E GAA 9:20 Intel 20A & 18A RibbonFET 10:04 TSMC Nanosheets 11:07 GAA & The Future of Transistors </video> <video> ZEN 5 has a 3D V-Cache Secret Description: In-depth silicon analysis of AMD's Zen 5 Ryzen 9000 CPUs based on ultra high-res die shots from @FritzchensFritz. Fritzchens Fritz Flickr: https://www.flickr.com/people/130561288@N04/ Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter: https://twitter.com/highyieldYT 0:00 Intro 0:59 Zen 5 Chiplet layout 2:42 IO-die - Overview 3:21 IO-die - Silicon analysis 6:05 CCD - Overview 9:42 TSVs & TSMC SoIC 10:34 Zen 5 X3D / 3D V-Cache 16:04 Zen 5 CPU Cores 18:28 Final thoughts </video> <video> Valve Steam Deck Chip Deep-Dive (AMD Van Gogh/Aerith) Description: A deep-dive into Valve's Steam Deck Aerith APU / AMD's Van Gogh with never before seen die-shots from Fritzchens Fritz. Fritzchens Fritz ------------------------ Flickr: https://www.flickr.com/people/130561288@N04/ Twitter/X: https://twitter.com/FritzchensFritz YouTube: https://www.youtube.com/channel/UCs5nCbp43X9XVMhydXtRa9w Follow me on Twitter/X: https://twitter.com/highyieldYT Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 0:00 Intro 1:00 Van Gogh die-shots & specs 2:09 LPDDR5 PHY, Memory Controller, VCN 3:14 Zen 2 CPU cluster 6:26 RDNA2 GPU 9:10 I/O, USB, PCI-E 10:59 The Secret 11:40 Magic Leap 2 Mero 12:23 14-core CVIP 14:01 6nm Steam Deck OLED shrink 16:31 Final Thoughts </video> <video> AMD ZEN 6 — Next-gen Chiplets & Packaging Description: AMD's Infinity Fabric On-Package has been used since Zen 2 in 2019, it's time for a change! In this video we will discuss next-gen interconnect and packaging rumored to be introduced with Zen 6, including silicon interposer, silicon bridge and organic RDL technologies. Support the channel on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter/X: https://twitter.com/highyieldYT MLID Zen 6 leak video: https://www.youtube.com/watch?v=qpzTmKjaIMU 0:00 Intro 1:21 Infinity Fabric On-Package / Zen 2 3:22 Next-gen interconnects 3:46 Silicon Interposer Technology 6:12 Silicon Bridge Technology 9:22 Organic RDL Technology / AMD Infinity Links 13:11 Zen 6 Layout & Packaging 15:14 Conclusion </video> <video> How this tiny GPU invented the Future Description: A tiny GPU with a big secret: how AMD's Fiji invented the future as the first HBM + silicon interposer GPU for the mass market. Support the channel on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter: https://twitter.com/highyieldYT Fritzchens Fritz https://twitter.com/FritzchensFritz https://www.flickr.com/people/130561288@N04/ </video> <video> Why 14900K & 13900KS are (basically) the same Description: Are Core i9-14900K, i7-14700K and i5-14600K really different, or is Intel selling last-gen CPUs with new names? Let's find out... Follow me on Twitter/X: https://twitter.com/highyieldYT Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 0:00 Intro 0:48 4 Upgrade Dimensions 3:13 Alder Lake / 12th Gen 4:00 Raptor Lake / 13th Gen 4:59 Raptor Lake Refresh / 14th Gen 6:21 When is a CPU actually "new"? 7:06 Is Intels 14th Gen "bad"? </video> <video> Why AMD's first Hybrid-CPU is Different Description: AMD's first ever hybrid CPU is here: Phoenix 2 combines Zen 4 & Zen 4c cores into a single chip. But this asymmetrical design does everything different than the competition (chip deep-dive). Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter / X: https://twitter.com/highyieldYT SemiAnalysis Zen 4c article: https://www.semianalysis.com/p/zen-4c-amds-response-to-hyperscale 0:00 Intro 1:03 The Silicon Layer / die-shot analysis 1:52 RDNA3 iGPU 2:25 The Hybrid CPU / Zen 4 vs Zen 4c 4:35 Explaining the size difference / Cell density 5:25 Design Process 7:23 AMD vs Intel vs ARM </video> <video> Why next-gen chips separate Data & Power Description: Backside Power Delivery promises huge efficiency and performance advantages for modern computer chips, but also changes the semiconductor manufacturing process. Let's go an a deep-dive into Intel's PowerVia technology. Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter/X: https://twitter.com/highyieldYT 0:00 Intro 0:55 Current semiconductor manufacturing 3:27 The problem with the frontside silicon & metal layers 7:35 Backside Power Delivery manufacturing 11:06 Advantages of BSPD / Intel PowerVia / Blue Sky Creek 14:24 Design-Technology Co-Optimization / cell area scaling 15:54 The Future of Semiconductor manufacturing </video> <video> Why Hybrid Bonding is the Future of Packaging Description: Hybrid bonding, the technology behind AMD's 3D V-Cache, changes semiconductor packaging. Here's how it really works. Become a supporter on Patreon: https://www.patreon.com/c/user?u=46978634 Follow me on Twitter/X: https://twitter.com/highyieldYT Follow me on Bsky: https://bsky.app/profile/highyield.bsky.social SemiAnalysis articles Part 1: https://semianalysis.com/2021/12/15/advanced-packaging-part-1-pad-limited/ Part 2: https://semianalysis.com/2022/01/06/advanced-packaging-part-2-review/ Part 3: https://semianalysis.com/2022/01/19/advanced-packaging-part-3-intels/ Part 4: https://semianalysis.com/2022/11/01/the-future-of-packaging-gets-blurry/ Part 5: https://semianalysis.com/2024/02/09/hybrid-bonding-process-flow-advanced/ 0:00 Intro 1:11 History of solder based packaging 3:48 Hybrid Bonding 5:58 Direct copper-to-copper bonding 8:01 Why hybrid bonding needs a FAB / TSMC SoIC 9:42 Wafer-to-Wafer & Chip-to-Wafer / Die-to-Wafer 12:59 1st gen 3D V-Cache Process Flow / Zen3D 17:06 How a 7800X3D die really looks like 18:38 2nd gen 3D V-Cache Process Flow / Zen 5 X3D 20:57 How a 9800X3D die really looks like 21:45 Power delivery & TSVs 22:58 AMD's next-gen packaging </video> <video> The Story of Snapdragon X Elite Description: Two lawsuits & a mystery: The Story of Snapdragon X Elite | In this video we will take a look at the exciting history of Qualcomm's new Arm SoC that aims to bring Apple-like performance to Windows on Arm. Follow me on Twitter/X: https://x.com/highyieldYT Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 0:00 Intro 0:20 The early beginnings / Apple A4 / P.A. Semi / Intrinsity 1:40 Custom Arm CPUs / Apple A6 3:18 Nuvia & Apple lawsuit 5:17 Nuvia Orion SoC & Phoenix CPU 6:20 Qualcomm & Nuvia 7:13 Arm lawsuit 8:06 Snapdragon X Elite SoC / Oryon CPU 10:19 Adreno GPU / Hexagon NPU / System Memory 11:43 Snapdragon X Elite specs / Windows on Arm 13:19 The competition / Intel Lunar Lake / AMD Strix Point / Apple M4 </video> <video> How long can Nvidia stay monolithic? Description: Is Nvidia losing the chiplet race? AMD & Intel are already building complex chiplet GPUs while Nvidia seems to be stuck with monolithic designs. Let's take a closer look! Support me on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter: https://twitter.com/highyieldYT 0:00 Intro 1:24 Nvidia Chiplet R&D 3:48 Gaming vs HPC/AI GPUs 7:05 Process Node Implications / TSMC N3E 9:24 High-NA EU Implications 10:50 Energy & Space Efficiency 11:50 Competition from AMD & Intel 12:44 Conclusion </video> <video> Hands-on with Lunar Lake Description: Hands-on with a real LNL chip, discussing the architecture & my opinion on the Intel Lunar Lake launch at IFA 2024 in Berlin. Can Lunar Lake compete with AMD's Zen 5 Strix Point and Qualcomm's Snapdragon X Elite? Follow me on Twitter/X: https://x.com/highyieldYT Become a supporter on Patreon: https://www.patreon.com/user?u=46978634 </video>

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Analysis, commentary and current developments in hardware and tech.

Everything silicon.

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